Senior Process Development Engineer Full Time NEW

Gardena, CA | Onsite

Opportunity Summary

A well-funded stealth startup is developing breakthrough optical computing hardware designed to surpass the limitations of traditional electronics. Backed by experienced founders and early-stage investors, the team is combining advanced photonics, packaging, and manufacturing under one roof. We’re looking for a Senior Process Engineer to lead key development efforts in wafer and die-level packaging. This role is hands-on, highly technical, and central to launching our first product.

About Us

We’re an ambitious group of engineers, scientists, and builders focused on optical computing innovation. Our startup combines experience from previous frontier tech ventures with a shared mission to redefine how light is used in computational systems. With early funding secured, we’re building both the hardware and the factory floor to scale it, developing vertically integrated systems that blend photonics, electronics, and manufacturing into a cohesive, next-generation computing platform.

Job Duties

• Develop and own process recipes for wafer-level and die-level packaging techniques, including eutectic bonding, flip-chip attachment, underfill, and protective coatings
• Achieve high-yield bonding (>99.9%) and ensure thermal reliability through 20,000+ cycles
• Analyze failure mechanisms using X-ray, SAM, SEM/TEM, shear testing, and other methods, feeding results back into process and design improvements
• Lead the transition of R&D processes into repeatable, high-volume production workflows using SPC and tool selection methodologies
• Serve as technical lead for corrective actions stemming from root cause analysis and field data
• Collaborate across design, electrical, and mechanical engineering teams to fine-tune packaging architecture
• Support hiring efforts and mentor junior engineers to grow internal manufacturing capabilities

Qualifications

• MS or PhD in Materials Science, Electrical Engineering, Chemical Engineering, or a related field
• 3+ years of hands-on experience in semiconductor process development or advanced packaging
• Proven track record developing and qualifying bonding processes such as eutectic, flip-chip, or hybrid methods
• Strong command of statistical quality control practices and continuous improvement strategies
• Comfortable working in a fast-paced lab and production environment, including extended hours when needed

Preferred Experience

• Background in nanofabrication techniques (e-beam lithography, dry etch, PECVD, CMP)
• Experience integrating photonic components such as SiPh or InP into electronic packages
• Prior work with optoelectronic device packaging or hybrid integration

Why Join Us

• High-impact opportunity at the forefront of photonics and next-gen computing
• Seed-funded startup with ambitious growth plans and hands-on technical leadership
• Early-stage equity and long-term incentive plans
• Flexible work culture and strong support for innovation
• Relocation assistance to Southern California
• Comprehensive health coverage: medical, dental, and vision
• Paid parental leave, flexible vacation policy, and company holidays

Compensation Details

$120,000 – $200,000 plus equity