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Role Number: 200666852-3401
Summary
At Apple, we believe new insights have a way of becoming extraordinary products, services, and customer experiences very quickly. Our Hardware Technology Packaging team invents, designs, develops, and integrates electronic packaging solutions for Apple’s internal and custom external components of hardware for its consumer electronic products such as iPhone, iPad, Mac, Apple Watch, Apple TV, etc. In this highly visible role, you will own and drive sophisticated package selection, new-generation product package structure and configuration optimization. You will be responsible for Apple Package substrate including design, technology, manufacturing, and reliability, and future roadmap; and work with a cross-functional team to achieve the best package performance.
Description
Lead RFSIP package substrate development, pathfinding technology, and roadmap definition.
Work with substrate manufacturing industry, foundry, and OSAT to bring package substrate solution from concept to HVM.
Work across a variety of cross-functional groups directly and involve themselves in engineering and product development.
Drive industry with sophisticated package solutions, new material development, and specs.
5% International travel.
Minimum Qualifications
BS and 10+ years of relevant industry experience.
Preferred Qualifications
MS or Ph.D. and 5+ years of relevant industry experience.
Proven fundamentals in the material/chemistry/ or mechanical engineering field(s).
In-depth knowledge of substrate technology, manufacturing process, design rules, and roadmap.
Hands-on experience in substrate manufacturing and technology development: Cu plating, Lithography, Dielectric material, Laser via formation, Solder resist, etc.
Familiar with package assembly and integration process preferred.
Experience in Cadence Allegro platform tools and design review for manufacturing (DFM).
Exceptional technology development & project management skills.
Strong communication & collaborative skills.
